Huawei has launched enterprise Huawei SSD with impressive capacities of 61.44 TB and 122.88 TB at the Huawei ID Forum 2026 in Paris. According to recent reports, Huawei has introduced a new storage packaging approach called Die-on-Board (DoB) technology, which may allow much higher SSD capacities while reducing physical space requirements. This method allows NAND flash dies to be directly mounted onto the printed circuit board. By removing traditional packaging requirements, Huawei achieves a remarkable density increase of around 33%, optimizing the storage potential of each drive.

This innovation allows Huawei to bypass strict US trade sanctions by achieving ultra-high hyperscale capacity without relying on advanced, restricted Western 3D NAND technology. The international suppliers cannot sell these high-density components to Huawei due to the strict 2019 US Department of Commerce entity listings. Huawei was forced to rely only on domestic supply chains as a result of this restriction. Moreover, Huawei is finding ways to squeeze more capacity out of the hardware it can access.

YMTC, the primary memory manufacturer in China, provides solid alternatives such as their Xtacking 4.0 design, which currently tops out at 232 layers. Due to this technical limitation, Huawei’s enterprise storage products risked lagging behind those of international competitors with easier access to denser flash components. 

• Die-On-Board (DoB) Packaging: It is a proprietary wafer-level packaging technology that mounts raw NAND dies directly onto the SSD’s printed circuit board (PCB). Developed as a workaround to US sanctions, it eliminates traditional bulky packaging (like TSOP or BGA) to increase data density by 33% using less dense Chinese-manufactured 3D NAND. The DoB method is the driving force behind Huawei’s massive enterprise SSDs, such as the 61.44 TB and the 122.88 TB storage solutions used in its OceanStor data center and AI arrays. 

• On-Drive AI Processing: According to the report made by Valuethemarkets, the newly released 122.88 TB SSDs are integrated into Huawei’s OceanStor Pacific 9926 all-flash array. When fully populated with 36 drives, a single system offers 4.42 PB of raw storage, and the impressive data compression technology boosts effective capacity to approximately 11 PB. These drives cater primarily to AI inference, data center operations, and scalable storage solutions. The architecture embeds an AI acceleration unit into the drive’s main control chip, which enables storage and computing to occur simultaneously and reduces data transfer energy by 80%. 

Huawei is actively deploying these dense storage units across its enterprise and scale-out architecture.

• OceanStor Pacific 9926: The 122.88 TB and companion 61.44 TB drives are integrated directly into Huawei’s All-Flash Array (AFA) scale-out infrastructure.

• OceanDisk 1800: This specialized storage solution addresses the core engineering challenges of DoB packaging, primarily thermal management and signal integrity caused by packing components so tightly together. 

Notably, future plans include an upcoming, pure capacity-focused tier leveraging a 36-layer process to touch 245 TB of storage capacity. 

Huawei’s innovative DoB packaging method is evidence of how technical ingenuity can counteract limitations brought on by component availability. YMTC plays a very important role here. As Huawei’s main domestic NAND supplier, enhancements in YMTC’s layer counts could vastly improve storage densities, boosting potential without altering existing packaging methods. Instead of relying entirely on traditional supply chains, Huawei appears focused on developing alternative approaches and increasing domestic technology capabilities.

This strategic move is critical as US export controls aim to slow China’s advances in AI and high-tech sectors by limiting access to sophisticated semiconductor technology. These developments can have a significant impact on AI technologies and enterprise storage solutions. As AI systems continue growing, the companies controlling storage and computing infrastructure may play a major role in shaping the future of digital services.