Вход на сайт

Просмотр новости

Найдите то, что Вас интересует

PART MODEL SCHEMAS

Дата публикации: 14-05-2024 18:17:54

JEP30-10v10-0-02026-08-11 00:00:00This download includes all files under the parent schema JEP30-10v10-0-0 (Committees: JC-11, JC-11.2) including:JEP30-A101v3-0-0 (Assembly Process),Committees: JC-11, JC-11.2, JC-14JEP30-E101v6-1-0 (Electrical),Committees: JC-11, JC-11.2, JC-16JEP30-P101v10-0-0 (Package),Committees: JC-11, JC-11.2JEP30-S101v2-0-3 (Supply Chain),Committees: JC-11, JC-11.2, JC-14JEP30-T101v4-0-0 (Thermal)Committees: JC-11, JC-11.2, JC-15JEP30-K101v2-1-0 (Design Rule Kits)Committees: JC-11, JC-11.2, JC-15, JC-16JEP30-M101v1-2-0 (ECAD Models Guidelines)Committees: JC-11, JC-11.2, JC-16JEP30-PX101v2-0-0 (Product Substrate and Assemblies)Committees: JC-11, JC-11.2JEP30-Q101v1-0-0 (Qualification Data)Committees: JC-11, JC-11.2, JC-14JEP30-D10v7-0-0 (Types Dictionary)Committees: JC-11, JC-11.2This will enable the user to validate the schemas. For more information visit the main JEP30 webpage.Committees: JC-11JC-11.2JC-14JC-15JC-16

Основное содержимое страницы с новостью.

Please enable cookies.

Sorry, you have been blocked You are unable to access jedec.org
Why have I been blocked?

This website is using a security service to protect itself from online attacks. The action you just performed triggered the security solution. There are several actions that could trigger this block including submitting a certain word or phrase, a SQL command or malformed data.

What can I do to resolve this?

You can email the site owner to let them know you were blocked. Please include what you were doing when this page came up and the Cloudflare Ray ID found at the bottom of this page.

Cloudflare Ray ID: a2b5f81bdf170909 Your IP: 45.147.101.248 Performance & security by Cloudflare

Схожие новости

#Наименование новостиТональностьИнформативностьДата публикации
1PartModel Generated ECAD Models -Guidelines for Electronic-Device Packages – XML Requirements016.8312-02-2025
2PartModel Design Rule Kits Guidelines for Electronic-Device Packages – XML Requirements017.1412-02-2025
3PartModel Electrical Guidelines for Electronic-Device Packages – XML Requirements017.4609-03-2023
4Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements016.5109-03-2023
5PartModel Product Guidelines for Electronic-Device Substrates and Assemblies – XML Requirements016.5130-09-2025
6PartModel SupplyChain Guidelines for Electronic-Device Packages – XML Requirements017.4609-03-2023
7PartModel QualificationData -Guidelines for Electronic-Device Packages – XML Requirements017.7807-08-2026
8Foundry Process Qualification Guidelines – Technology Qualification Vehicle Testing033.0317-09-2018
9Stress Test Driven Qualification of Integrated Circuits029.0820-03-2009
10Silicon Photonics Qualification and Reliability Requirements031.6614-08-2026

Классификация: Пресс-релизы. Схожих патентов: 0. Схожих новостей: 10. Тональность: 0. Информативность: 16.49. Источник: www.jedec.org.