Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of its next-generation packaging technology, embedded multi-die interconnect bridge-through-silicon via (EMIB-T), positioning it to compete with TSMC.
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| # | Наименование новости | Тональность | Информативность | Дата публикации |
|---|---|---|---|---|
| 1 | Reports: Intel considers partner to help run Ohio plant | 0 | 8.75 | 24-07-2026 |
| 2 | Intel EMIB yields hit target, MediaTek eyes 2028 ASIC ramp | 0 | 15.95 | 03-08-2026 |
| 3 | TSMC разрабатывает технологию упаковки для конкуренции с Intel EMIB | 0 | 7.84 | 30-07-2026 |
| 4 | India advances semiconductor ambitions as Visakhapatnam OSAT plant anchors South India packaging push | 0 | 13.56 | 03-08-2026 |
| 5 | Trotz roter Zahlen: Intel investiert Milliarden in irische Halbleiterfabrik | 0 | 5 | 13-07-2026 |
| 6 | Intel отказалась от планов строительства заводов в Германии и Польше | 0 | 0 | 25-07-2025 |
| 7 | Infineon hätte gern ein TSMC-Werk für feinste Chipstrukturen in Deutschland | 2 | 6 | 08-07-2026 |
| 8 | Inversion Semiconductor targets ASML with particle-accelerator X-ray lithography | 0 | 14.13 | 03-08-2026 |
| 9 | Chip-Konzern: Intel baut für fünf Milliarden Dollar Werk in Irland aus | 0 | 5 | 13-07-2026 |
| 10 | Intel инвестирует $36,3 млрд в производство полупроводников в ЕС | 0 | 0 | 15-03-2022 |