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Intel offers bonuses to speed up Ohio fab construction and reaches EMIB-T yields of 90%

Дата публикации: 03-08-2026 07:30:00

Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of its next-generation packaging technology, embedded multi-die interconnect bridge-through-silicon via (EMIB-T), positioning it to compete with TSMC.

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